Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas.

You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
As a Thermal & Mechanical Packaging Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the hardware that goes into our cutting-edge data centers affecting millions of AWS users.