Senior Principal Packaging Engineer

Overview

Responsible for managing a small group of engineers in charge of all aspects of packaging for MACOMs Lightwave products. Including TO-cans, TOSA/ROSA, Chip on Carrier, etc. Oversee all packaging development activities, while driving continuous improvement and supporting the sustaining of existing technologies. This position requires a strong understanding of packaging fundamentals as well as strong leadership and communication skills.

Responsibilities

• Serve as the primary interface for package design and improvements, between external suppliers and internal design teams for the entire Lightwave BU.
• Work closely with MACOM multi-functional teams to provide guidance on correlation of package design architecture to assembly process constraints and help with solving issues and resolving yield and reliability problems as they come along.
• Delivering appropriate design rule decks and lead DFM/DFR activities, lead substrate fabrication, package assembly and package qualification with external partners and suppliers Collaborate with the photonics design team to optimize performance, reliability and manufacturability.
• MACOMs existing TO-can engineers in Taiwan and China will report to KC.
• Design/develop new packaging techniques to support new product introduction.
• Drive yield improvement Improve and develop strong process controls with MACOMs contract manufacturer’s in Asia Coaching/Mentoring process engineers.
• Help drive mentality of true root cause analysis and identify permanent solutions.
• Aid in cost reduction for LW packaging solutions.
• Work with Manufacturing to improve and streamline existing processes for increased accuracy and efficiencies.