TW_感測器研發_Packaging Development Engineer (MEMS products)

Responsibilities

• Define & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.
• Design coordination: Coordinate package design and process development for electronic MEMS sensors in collaboration with internal engineering teams and external suppliers.
• Process engineering: Develop and optimize assembly processes for MEMS in automotive and consumer-electronics applications.
• Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.
• Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.